Interfacial Engineering Using Additive Manufacturing to Decouple Electrical and Thermal Conductivity for Next-Generation Thermoelectrics

dc.contributor.authorMadan, Deepa
dc.contributor.authorHuang, Jiyuan
dc.contributor.authorAmbade, Rohan B.
dc.contributor.authorBrooks, Benjamin
dc.contributor.authorLombardo, Jacob
dc.contributor.authorPoosapati, Aswani
dc.contributor.authorBanerjee, Priyanshu
dc.contributor.authorSaeidi-Javash, Mortaza
dc.contributor.authorZhang, Yanliang
dc.date.accessioned2025-08-13T20:14:17Z
dc.date.issued2023-08-22
dc.description.abstractAdditive manufacturing has been investigated as a more time, energy, and cost-efficient method for fabricating thermoelectric generators (TEGs). Early results have been promising but are held back by the necessary inclusion of a high-temperature, long-duration curing process to produce high-performance thermoelectric (TE) films. This work investigates the synergistic effect of four factors – a small amount of chitosan binder (0.05wt%), a heterogeneous particle size distribution, the application of mechanical pressure, and thickness variation – on the performance of p-Bi₀.₅Sb₁.₅Te₃ (p-BST) and n-Bi₂Te₂.₇Se₀.₃ (n-BTS) TE composite films. The combination of these four factors controls the micro and nanostructure of the films to decouple their electrical and thermal conductivity effectively. This resulted in figures of merit (ZTs) (0.89 and 0.5 for p-BST and n-BTS, respectively) comparable to other additive manufacturing methods despite eliminating the high-temperature, long-duration curing process. The process was also used to fabricate a 6-couple TEG device which could generate 357.6 µW with a power density of 5.0 mW/cm² at a ∆T of 40 K. The device demonstrated air stability and flexibility for 1000 cycles of bending. Finally, the device was integrated with a voltage step-up converter to power a LED and charge and discharge capacitor at a ∆T of 17 K, demonstrating its applicability as a self-sufficient power source.
dc.description.sponsorshipThe authors thank August Phelps, Abbas Bharmal, Kattab Salih, Kojo Benefo, Salman Mirza, and Sakshi Singh for conducting experiments and editing the manuscript. In addition, the authors thank Prof. Erin Lavik for allowing them to use the Keyence microscope. Dr. D. Madan would like to acknowledge the funding support from National Science Foundation under award CMMI-2238996 and TEDCO-Maryland Innovation Initiative. M. S. and Y. Z. would like to acknowledge funding support from the National Science Foundation under award CMMI-1747685
dc.description.urihttps://papers.ssrn.com/abstract=4548128
dc.format.extent39 pages
dc.genrejournal articles
dc.genrepreprints
dc.identifierdoi:10.13016/m2sotc-styi
dc.identifier.urihttps://dx.doi.org/10.2139/ssrn.4548128
dc.identifier.urihttp://hdl.handle.net/11603/39729
dc.language.isoen
dc.relation.isAvailableAtThe University of Maryland, Baltimore County (UMBC)
dc.relation.ispartofUMBC Faculty Collection
dc.relation.ispartofUMBC Mechanical Engineering Department
dc.relation.ispartofUMBC Student Collection
dc.rightsThis item is likely protected under Title 17 of the U.S. Copyright Law. Unless on a Creative Commons license, for uses protected by Copyright Law, contact the copyright holder or the author.
dc.subjectcapacitor charging
dc.subjectLED light up
dc.subjectprinted thermoelectric device
dc.subjectp-type Bi0.5Sb1.5Te3
dc.subjectcomposite thermoelectric film
dc.subjectUMBC FlexMESHED Lab
dc.subjectUMBC Mechanical Engineering S-STEM Program
dc.subjectn-type Bi2Te2.7Se0.3
dc.subjectUMBC Bioheat Transfer Laboratory
dc.subjectUMBC Estimation, Control, and Learning Laboratory (ECLL)
dc.titleInterfacial Engineering Using Additive Manufacturing to Decouple Electrical and Thermal Conductivity for Next-Generation Thermoelectrics
dc.typeText
dcterms.creatorhttps://orcid.org/0000-0002-0061-2715
dcterms.creatorhttps://orcid.org/0009-0006-8899-5736
dcterms.creatorhttps://orcid.org/0000-0002-4578-1117
dcterms.creatorhttps://orcid.org/0009-0002-4142-729X
dcterms.creatorhttps://orcid.org/0009-0006-5125-0511

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