Contributions to composite conductivity and Seebeck coefficient in commercial Bi₂Te₃—Conjugated polymer composites

dc.contributor.authorHuang, Jiyuan
dc.contributor.authorLi, Hui
dc.contributor.authorKirksey, Evan
dc.contributor.authorHoffman, Christina
dc.contributor.authorJang, Hyun-June
dc.contributor.authorWagner, Justine
dc.contributor.authorMadan, Deepa
dc.contributor.authorKatz, Howard E.
dc.date.accessioned2019-04-26T17:59:27Z
dc.date.available2019-04-26T17:59:27Z
dc.date.issued2019-03-28
dc.description.abstractWe demonstrated the use of as-received conjugated polymer P3HT [poly (3-hexylthiophene-2,5 diyl)] doped with F4TCNQ (2,3,5,6- tetrafluoro-7,7,8,8-tetracyanoquinodimethane) as a matrix for forming a composite with as-received, commercially available p-type Bi2Te3 powder. The optimized formulation exhibits a power factor of up to 5:3 μWK⁻² m⁻¹, about nine times higher than the highest power factor that we achieved from mixtures of only P3HT and F4TCNQ. Bi2Te3 was responsible for increases in both the Seebeck coefficient and the electrical conductivity. P3HT, with a higher hole mobility, was superior to PQT-12 [poly(bisdodecylquaterthiophene)], and F4TCNQ was at least as good as FeCl3, for matrix and dopant, respectively, for this purpose. The power factor obtained is about 40% of that reportedly obtained from synthesized Bi2Te3 nanowires in FeCl3-doped P3HT. We calculated the expected contributions of the bulk Bi2Te3 to the composite conductivity and then examined the resistance caused by interfaces on four different size distributions of Bi2Te3 particles, as well as a solid macroscopic ingot. A nonlinear I–V relationship was found for the doped P3HT-ingot bilayer. While our doped conjugated polymer system made only from commercial-grade components was shown to support the extraction of thermoelectric performance by a commonly used inorganic semiconductor, our results also suggest that an advantage of the smallest Bi2Te3 domains, including nanowires, may arise from their having less interfacial resistance than larger Bi2Te3 particles and pieces.en_US
dc.description.sponsorshipWe thank the National Science Foundation, Division of Chemistry (Grant No. 1708245) for support. We acknowledge the assistance of Anthony Lewis and Phillip Chapman for the SEM imaging.en_US
dc.description.urihttps://aip.scitation.org/doi/abs/10.1063/1.5089872en_US
dc.format.extent9 pagesen_US
dc.genrejournal articlesen_US
dc.identifierdoi:10.13016/m2qkkv-hypw
dc.identifier.citationJiyuan Huang, Hui Li, Evan Kirksey, et.al, Contributions to composite conductivity and Seebeck coefficient in commercial Bi₂Te₃—Conjugated polymer composites, Journal of Applied Physics,125, 125502 (2019); https://doi.org/10.1063/1.5089872en_US
dc.identifier.urihttps://doi.org/10.1063/1.5089872
dc.identifier.urihttp://hdl.handle.net/11603/13516
dc.language.isoen_USen_US
dc.publisherAIP Publishingen_US
dc.relation.isAvailableAtThe University of Maryland, Baltimore County (UMBC)
dc.relation.ispartofUMBC Physics Department Collection
dc.relation.ispartofUMBC Faculty Collection
dc.relation.ispartofUMBC Student Collection
dc.rightsThis item is likely protected under Title 17 of the U.S. Copyright Law. Unless on a Creative Commons license, for uses protected by Copyright Law, contact the copyright holder or the author.
dc.rightsThis article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. This article appeared in Jiyuan Huang, Hui Li, Evan Kirksey, et.al, Contributions to composite conductivity and Seebeck coefficient in commercial Bi₂Te₃—Conjugated polymer composites, Journal of Applied Physics,125, 125502 (2019); https://doi.org/10.1063/1.5089872 and may be found at https://aip.scitation.org/doi/abs/10.1063/1.5089872.
dc.rightsAccess to this item will begin on March 28, 2020
dc.subjectconjugated polymeren_US
dc.subjectP3HTen_US
dc.subjectF4TCNQen_US
dc.subjectnanowiresen_US
dc.titleContributions to composite conductivity and Seebeck coefficient in commercial Bi₂Te₃—Conjugated polymer compositesen_US
dc.typeTexten_US

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