Thermoelectric Performance Enhancement of n-type Chitosan-Bi₂Te₂.7Se₀.₃ Composite Films Using Heterogeneous Grains and Mechanical Pressure

dc.contributor.authorBanerjee, Priyanshu
dc.contributor.authorJang, Eunhwa
dc.contributor.authorHuang, Jiyuan
dc.contributor.authorHolley, Rudolph
dc.contributor.authorVadnala, Sudharshan
dc.contributor.authorSheikh, Adnan
dc.contributor.authorTrivedi, Arjun
dc.contributor.authorJackson, Kendall
dc.contributor.authorHomman, Vincent Kai
dc.contributor.authorMadan, Deepa
dc.date.accessioned2024-01-17T15:27:58Z
dc.date.available2024-01-17T15:27:58Z
dc.date.issued2021-02-27
dc.description.abstractA cost-effective and sustainable approach was used to enhance the thermoelectric performance of printable thermoelectric composite films. Using this approach, we are trying to get rid of the highly energy-intensive (high temperature and long duration) and time-consuming process of manufacturing thermoelectric generators. This study presents a unique approach of using an environmental-friendly and naturally occurring binder, a heterogeneous particle size distribution and applied mechanical pressure to fabricate n-type thermoelectric composite films. Recently spotlighted biomaterial, chitosan, was employed as a binder and it provided enough binding strength to the composite thermoelectric films. Bi₂Te₂.7Se₀.₃ is an attractive n-type thermoelectric material because of its high thermoelectric performance. In this work, we are using two different (100-mesh and 325-mesh) n-type Bi₂Te₂.7Se₀.₃ thermoelectric conductive particles for thermoelectric composite films to understand the role of wide-range particle distribution on thermoelectric composite films. In addition, two different weight ratios (1:2000 and 1:5000) of binders to Bi₂Te₂.7Se₀.₃ particle and two different applied pressures (150 MPa and 200 MPa) were used for this study. The application of pressure and the use of a heterogenous particle distribution improves the packing density which leads to well-aggregated and coalesced polycrystal bulk-like structure in chitosan 100-mesh (heterogeneous particle distribution) Bi₂Te₂.7Se₀.₃ thermoelectric composite films and hence improves the overall electrical conductivity and power factor. The best performing composite film was made with an ink of a 1:2000 weight ratio of binder to100-mesh Bi₂Te₂.7Se₀.₃ and the applied pressure was 200 MPa. The electrical conductivity was 200 ± 7 S cm⁻¹, the Seebeck coefficient was −201 ± 6 µV K⁻¹, the power factor was 808 ± 69.7 μW m⁻¹ K⁻², the thermal conductivity was 0.6 W m⁻¹ K⁻¹, and the figure of merit was 0.4 at room temperature. Using energy efficient, sustainable, and cost effective method we achieved ZT of 0.40 for n-type thermoelectric composite films which is comparable to other printed n-type TE composite films. A 2-leg n-type Bi₂Te₂.7Se₀.₃ device was fabricated with a power output of 0.48 μW at a closed circuit voltage of 2.1 mV and ∆T of 12 K.
dc.description.sponsorshipThe authors would like to thank Aakash Satish from Reservoir High School and Preetham Gowni from Mount Hebron High School for their contributions in experimental work. The authors would also like to thanks Aswani Poosapati and Karla Negrette to help reviewing the manuscript. The authors would also like to thank Dr. Erin Lavik and their research group for letting us use Keyence microscope in their lab for density measurements This work was supported by Dr. Deepa Madan’s startup fund from University of Maryland Baltimore County, Baltimore.
dc.description.urihttps://link.springer.com/article/10.1007/s11664-021-08798-8
dc.format.extent31 pages
dc.genrejournal articles
dc.genrepreprints
dc.identifier.citationBanerjee, Priyanshu, Eunhwa Jang, Jiyuan Huang, Rudolph Holley, Sudharshan Vadnala, Adnan Sheikh, Arjun Trivedi, Kendall Jackson, Vincent Kai Homman, and Deepa Madan. “Thermoelectric Performance Enhancement of N-Type Chitosan-Bi₂Te₂.7Se₀.₃ Composite Films Using Heterogeneous Grains and Mechanical Pressure.” Journal of Electronic Materials 50, no. 5 (May 1, 2021): 2840–51. https://doi.org/10.1007/s11664-021-08798-8.
dc.identifier.urihttps://doi.org/10.1007/s11664-021-08798-8
dc.identifier.urihttp://hdl.handle.net/11603/31327
dc.language.isoen_US
dc.publisherSpringer
dc.relation.isAvailableAtThe University of Maryland, Baltimore County (UMBC)
dc.relation.ispartofUMBC Mechanical Engineering Department Collection
dc.relation.ispartofUMBC Faculty Collection
dc.relation.ispartofUMBC Student Collection
dc.rightsThis item is likely protected under Title 17 of the U.S. Copyright Law. Unless on a Creative Commons license, for uses protected by Copyright Law, contact the copyright holder or the author.
dc.titleThermoelectric Performance Enhancement of n-type Chitosan-Bi₂Te₂.7Se₀.₃ Composite Films Using Heterogeneous Grains and Mechanical Pressure
dc.typeText
dcterms.creatorhttps://orcid.org/0000-0002-4578-1117
dcterms.creatorhttps://orcid.org/0000-0002-0061-2715

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