A Multiscale Simulator for Low Pressure Chemical Vapor Deposition
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Gobbert, Matthias K., Tushar P. Merchant, Leonard J. Borucki, and Timothy S. Cale. “A Multiscale Simulator for Low Pressure Chemical Vapor Deposition.” Journal of The Electrochemical Society 144, no. 11 (1997): 3945. https://doi.org/10.1149/1.1838116.
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Abstract
An integrated simulator for chemical vapor deposition is introduced. In addition to reactor scale and feature scale simulators, it includes a “mesoscopic” scale simulator with the typical length scale of a die. It is shown that the “three‐scale” integrated simulator used is a proper extension of “two‐scale” deposition simulators that consist of reactor scale and feature scale simulation models. Moreover, it is demonstrated that information is provided on a new length scale, for which no information is available from the “two‐scale” approach, as well as important corrections to the simulation results on the reactor scale. This enables, for instance, studies of microloading. Thermally induced deposition of silicon dioxide from tetraethyoxysilane is chosen as the application example. The deposition chemistry is modeled using six gaseous reacting species involved in four gas‐phase and eight surface reactions.